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Computer memory chips are mounted on a finned metallic mount to protect them from overheating. A \(152-\mathrm{MB}\) memory chip dissipates \(5 \mathrm{~W}\) of heat to air at \(25^{\circ} \mathrm{C}\). If the temperature of this chip is not to exceed \(60^{\circ} \mathrm{C}\), the overall heat transfer coefficient- area product of the finned metal mount must be at least (a) \(0.14 \mathrm{~W} /{ }^{\circ} \mathrm{C}\) (b) \(0.20 \mathrm{~W} /{ }^{\circ} \mathrm{C}\) (c) \(0.32 \mathrm{~W} /{ }^{\circ} \mathrm{C}\) (d) \(0.48 \mathrm{~W} /{ }^{\circ} \mathrm{C}\) (e) \(0.76 \mathrm{~W} /{ }^{\circ} \mathrm{C}\)

Short Answer

Expert verified
Answer: (a) 0.14 W/℃

Step by step solution

01

We know the following values: Q = 5 W (heat dissipation of the memory chip) \(T_{chip}\) = 60℃ (maximum chip temperature) \(T_{air}\) = 25℃ (air temperature) Let's find the temperature difference ΔT and the minimum value for U·A. #Step 2: Calculate the temperature difference ΔT#

To find the temperature difference, we use the following equation: $$\Delta T = T_{chip} - T_{air}$$ Substitute the given values: $$\Delta T = 60^{\circ} \mathrm{C} - 25^{\circ} \mathrm{C} = 35^{\circ} \mathrm{C}$$ #Step 3: Use the heat transfer equation to find the minimum value for U·A#
02

In order to maintain the memory chip temperature below \(60^{\circ} \mathrm{C}\), the heat transfer equation must be satisfied with the given ΔT and the unknown U·A: $$Q = U\cdot A\cdot \Delta T$$ Now, we need to solve for U·A: $$U\cdot A = \frac{Q}{\Delta T}$$ Substitute the known values: $$U\cdot A = \frac{5 \mathrm{~W}}{35^{\circ} \mathrm{C}}$$ #Step 4: Calculate the minimum overall heat transfer coefficient-area product U·A#

Finally, we calculate the numerical value for U·A: $$U\cdot A = \frac{5 \mathrm{~W}}{35^{\circ} \mathrm{C}} = 0.142857 \mathrm{~W} /{ }^{\circ} \mathrm{C}$$ Upon analyzing the given choices, we can see that option (a) 0.14 W/℃ most closely matches our calculated result. Therefore, the overall heat transfer coefficient-area product of the finned metal mount must be at least 0.14 W/℃ to prevent the memory chip from exceeding 60℃. The correct answer is (a).

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Most popular questions from this chapter

Consider a tube for transporting steam that is not centered properly in a cylindrical insulation material \((k=0.73\) $\mathrm{W} / \mathrm{m} \cdot \mathrm{K})\(. The tube diameter is \)D_{1}=20 \mathrm{~cm}$ and the insulation diameter is \(D_{2}=40 \mathrm{~cm}\). The distance between the center of the tube and the center of the insulation is \(z=5 \mathrm{~mm}\). If the surface of the tube maintains a temperature of \(100^{\circ} \mathrm{C}\) and the outer surface temperature of the insulation is constant at \(30^{\circ} \mathrm{C}\),

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A 2.2-m-diameter spherical steel tank filled with iced water at $0^{\circ} \mathrm{C}$ is buried underground at a location where the thermal conductivity of the soil is \(k=0.55 \mathrm{~W} / \mathrm{m} \cdot \mathrm{K}\). The distance between the tank center and the ground surface is \(2.4 \mathrm{~m}\). For a ground surface temperature of \(18^{\circ} \mathrm{C}\), determine the rate of heat transfer to the iced water in the tank. What would your answer be if the soil temperature were \(18^{\circ} \mathrm{C}\) and the ground surface were insulated?

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