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A \(12-\mathrm{cm} \times 18-\mathrm{cm}\) circuit board houses on its surface 100 closely spaced logic chips, each dissipating \(0.06 \mathrm{~W}\) in an environment at \(40^{\circ} \mathrm{C}\). The heat transfer from the back surface of the board is negligible. If the heat transfer coefficient on the surface of the board is \(10 \mathrm{~W} / \mathrm{m}^{2} \cdot \mathrm{K}\), determine \((a)\) the heat flux on the surface of the circuit board, in W/ \(\mathrm{m}^{2}\); \((b)\) the surface temperature of the chips; and \((c)\) the thermal resistance between the surface of the circuit board and the cooling medium, in \({ }^{\circ} \mathrm{C} / \mathrm{W}\).

Short Answer

Expert verified
\(Q_{total} = 6 \, \mathrm{W}\)#tag_title#Step 2: Calculate the heat flux on the surface of the circuit board#tag_content#Next, we'll determine the heat flux by dividing the total heat dissipation by the circuit board area. Heat flux (\(q"_{board}\)) = \(Q_{total}\) / Area of the circuit board Circuit board area = Length × Width Area = \(0.1 \, \mathrm{m} \times 0.1 \, \mathrm{m}\) Area = \(0.01 \, \mathrm{m}^2\) Now we can calculate the heat flux: \(q"_{board} = \frac{6 \, \mathrm{W}}{0.01 \, \mathrm{m}^2}\)

Step by step solution

01

Determine the total heat generated by the chips

To find the total heat generated, we will multiply the number of chips by the heat dissipation per chip. Total heat dissipation (\(Q_{total}\)) = Number of chips × Heat dissipation per chip \(Q_{total} = 100 \times 0.06 \, \mathrm{W}\)

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Most popular questions from this chapter

Consider a pipe at a constant temperature whose radius is greater than the critical radius of insulation. Someone claims that the rate of heat loss from the pipe has increased when some insulation is added to the pipe. Is this claim valid?

Consider two identical people each generating \(60 \mathrm{~W}\) of metabolic heat steadily while doing sedentary work and dissipating it by convection and perspiration. The first person is wearing clothes made of 1 -mm-thick leather \((k=0.159 \mathrm{~W} / \mathrm{m} \cdot \mathrm{K})\) that covers half of the body, while the second one is wearing clothes made of 1-mm-thick synthetic fabric \((k=0.13 \mathrm{~W} / \mathrm{m} \cdot \mathrm{K})\) that covers the body completely. The ambient air is at \(30^{\circ} \mathrm{C}\), the heat transfer coefficient at the outer surface is $15 \mathrm{~W} / \mathrm{m}^{2} \cdot \mathrm{K}$, and the inner surface temperature of the clothes can be taken to be \(32^{\circ} \mathrm{C}\). Treating the body of each person as a \(25-\mathrm{cm}\)-diameter, \(1.7-\mathrm{m}\)-long cylinder, determine the fractions of heat lost from each person by perspiration.

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Explain how the fins enhance heat transfer from a surface. Also, explain how the addition of fins may actually decrease heat transfer from a surface.

Determine the winter \(R\)-value and the \(U\)-factor of a masonry cavity wall that is built around 4-in-thick concrete blocks made of lightweight aggregate. The outside is finished with 4 -in face brick with \(\frac{1}{2}\)-in cement mortar between the bricks and concrete blocks. The inside finish consists of \(\frac{1}{2}\)-in gypsum wallboard separated from the concrete block by \(\frac{3}{4}\)-in-thick (1-in by 3 -in nominal) vertical furring whose center- to-center distance is \(16 \mathrm{in}\). Neither side of the \(\frac{3}{4}\) in- thick airspace between the concrete block and the gypsum board is coated with any reflective film. When determining the \(R\)-value of the airspace, the temperature difference across it can be taken to be \(30^{\circ} \mathrm{F}\) with a mean air temperature of \(50^{\circ} \mathrm{F}\). The airspace constitutes 80 percent of the heat transmission area, while the vertical furring and similar structures constitute 20 percent.

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