Chapter 1: Problem 47
What is a blackbody? How do real bodies differ from blackbodies?
Chapter 1: Problem 47
What is a blackbody? How do real bodies differ from blackbodies?
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Get started for freeA solid plate, with a thickness of \(15 \mathrm{~cm}\) and a thermal conductivity of \(80 \mathrm{~W} / \mathrm{m} \cdot \mathrm{K}\), is being cooled at the upper surface by air. The air temperature is $10^{\circ} \mathrm{C}$, while the temperatures at the upper and lower surfaces of the plate are 50 and \(60^{\circ} \mathrm{C}\), respectively. Determine the convection heat transfer coefficient of air at the upper surface, and discuss whether the value is reasonable or not for forced convection of air.
We often turn the fan on in summer to help us cool. Explain how a fan makes us feel cooler in the summer. Also explain why some people use ceiling fans also in winter.
Heat treatment is common in processing of semiconductor material. A 200 -mm- diameter silicon wafer with thickness of \(725 \mu \mathrm{m}\) is being heat treated in a vacuum chamber by infrared heat. The surrounding walls of the chamber have a uniform temperature of \(310 \mathrm{~K}\). The infrared heater provides an incident radiation flux of \(200 \mathrm{~kW} / \mathrm{m}^{2}\) on the upper surface of the wafer, and the emissivity and absorptivity of the wafer surface are 0.70. Using a pyrometer, the lower surface temperature of the wafer is measured to be \(1000 \mathrm{~K}\). Assuming there is no radiation exchange between the lower surface of the wafer and the surroundings, determine the upper surface temperature of the wafer. (Note: A pyrometer is a noncontacting device that intercepts and measures thermal radiation. This device can be used to determine the temperature of an object's surface.)
The inner and outer surfaces of a \(0.5-\mathrm{cm}\) thick $2-\mathrm{m} \times 2-\mathrm{m}\( window glass in winter are \)10^{\circ} \mathrm{C}$ and \(3^{\circ} \mathrm{C}\), respectively. If the thermal conductivity of the glass is \(0.78 \mathrm{~W} / \mathrm{m} \cdot \mathrm{K}\), determine the amount of heat loss through the glass over a period of \(5 \mathrm{~h}\). What would your answer be if the glass were 1 cm thick?
The heat generated in the circuitry on the surface of a silicon chip $(k=130 \mathrm{~W} / \mathrm{m} \cdot \mathrm{K})$ is conducted to the ceramic substrate to which it is attached. The chip is $6 \mathrm{~mm} \times 6 \mathrm{~mm}\( in size and \)0.5 \mathrm{~mm}\( thick and dissipates \)3 \mathrm{~W}\( of power. Disregarding any heat transfer through the \)0.5$-mm- high side surfaces, determine the temperature difference between the front and back surfaces of the chip in steady operation.
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