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A \(0.3\)-cm-thick, \(12-\mathrm{cm}\)-high, and \(18-\mathrm{cm}\)-long circuit board houses 80 closely spaced logic chips on one side, each dissipating $0.06 \mathrm{~W}$. The board is impregnated with copper fillings and has an effective thermal conductivity of $16 \mathrm{~W} / \mathrm{m} \cdot \mathrm{K}$. All the heat generated in the chips is conducted across the circuit board and is dissipated from the back side of the board to the ambient air. Determine the temperature difference between the two sides of the circuit board. Answer: \(0.042^{\circ} \mathrm{C}\)

Short Answer

Expert verified
Answer: The temperature difference between the two sides of the circuit board is 0.042°C.

Step by step solution

01

Calculate the total heat generated by the logic chips

First, we need to find the total heat generated by all 80 logic chips. Each chip dissipates 0.06 W, so we can multiply this value by the total number of chips to find the total heat generation. \(Q_{total} = n \times Q_{chip}\) Where \(n\) is the number of logic chips and \(Q_{chip}\) is the heat dissipated by each chip.
02

Define the heat conduction equation

Next, we define the heat conduction equation and insert all the given values: \(Q_{total} = k \frac{A \Delta T}{d}\) Where \(Q_{total}\) is the total heat generation, \(k\) is the thermal conductivity of the circuit board (\(16 \mathrm{~W} / \mathrm{m} \cdot \mathrm{K}\)), \(A\) is the area of the circuit board, \(\Delta T\) is the temperature difference we are trying to find, and \(d\) is the thickness of the circuit board (\(0.3\) cm).
03

Calculate the area of the circuit board

Now, we need to calculate the area of the circuit board. The height and length are given as \(12 \text{ cm}\) and \(18 \text{ cm}\), respectively. \(A = height \times length = 12 \text{ cm} \times 18 \text{ cm} = 216 \text{ cm}^2\) To match the units with thermal conductivity, we should convert the area to \(\text{m}^2\): \(A = 216 \text{ cm}^2 \times \frac{1 \text{ m}^2}{10000 \text{ cm}^2} = 0.0216 \text{ m}^2\)
04

Substitute the values and find the temperature difference

Finally, we can substitute all the given values and the calculated area into the heat conduction equation: \(Q_{total} = k \frac{A \Delta T}{d}\) First, convert the thickness of the circuit board from cm to m: \(d = 0.3 \text{ cm} \times \frac{1 \text{ m}}{100\text{ cm}} = 0.003 \text{ m}\) Now, substitute the values: \(80 \times 0.06 \text{ W} = 16 \text{~W / m} \cdot \text{ K} \times \frac{0.0216 \text{ m}^2 \Delta T}{0.003 \text{ m}}\) Solve for the temperature difference, \(\Delta T\): \(\Delta T = \frac{80 \times 0.06 \text{~W} \times 0.003 \text{ m}}{16 \text{~W} / \text{m} \cdot \text{K} \times 0.0216 \text{ m}^2} = 0.042^{\circ} \text{C}\) So, the temperature difference between the two sides of the circuit board is \(0.042^{\circ} \text{C}\).

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Most popular questions from this chapter

On a still, clear night, the sky appears to be a blackbody with an equivalent temperature of \(250 \mathrm{~K}\). What is the air temperature when a strawberry field cools to \(0^{\circ} \mathrm{C}\) and freezes if the heat transfer coefficient between the plants and air is $6 \mathrm{~W} / \mathrm{m}^{2} \cdot \mathrm{K}$ because of a light breeze and the plants have an emissivity of \(0.9\) ? (a) \(14^{\circ} \mathrm{C}\) (b) \(7^{\circ} \mathrm{C}\) (c) \(3^{\circ} \mathrm{C}\) (d) \(0^{\circ} \mathrm{C}\) (e) \(-3^{\circ} \mathrm{C}\)

An electronic package in the shape of a sphere with an outer diameter of $100 \mathrm{~mm}$ is placed in a large laboratory room. The surface emissivity of the package can assume three different values \((0.2,0.25\), and \(0.3)\). The walls of the room are maintained at a constant temperature of $77 \mathrm{~K}$. The electronics in this package can only operate in the surface temperature range of $40^{\circ} \mathrm{C} \leq T_{s} \leq 85^{\circ} \mathrm{C}\(. Determine the range of power dissipation \)(\dot{W})$ for the electronic package over this temperature range for the three surface emissivity values \((\varepsilon)\). Plot the results in terms of \(\dot{W}(\mathrm{~W})\) vs. \(T_{s}\left({ }^{\circ} \mathrm{C}\right)\) for the three different values of emissivity over a surface temperature range of 40 to \(85^{\circ} \mathrm{C}\) with temperature increments of \(5^{\circ} \mathrm{C}\) (total of 10 data points for each \(\varepsilon\) value). Provide a computer- generated graph for the display of your results, and tabulate the data used for the graph. Comment on the results obtained.

A series of ASME SA-193 carbon steel bolts are bolted to the upper surface of a metal plate. The bottom surface of the plate is subjected to a uniform heat flux of \(5 \mathrm{~kW} / \mathrm{m}^{2}\). The upper surface of the plate is exposed to ambient air with a temperature of \(30^{\circ} \mathrm{C}\) and a convection heat transfer coefficient of \(10 \mathrm{~W} / \mathrm{m}^{2}\). K. The ASME Boiler and Pressure Vessel Code (ASME BPVC.IV-2015, HF-300) limits the maximum allowable use temperature to \(260^{\circ} \mathrm{C}\) for the SA-193 bolts. Determine whether the use of these SA-193 bolts complies with the ASME code under these conditions. If the temperature of the bolts exceeds the maximum allowable use temperature of the ASME code, discuss a possible solution to lower the temperature of the bolts.

The heat generated in the circuitry on the surface of a silicon chip $(k=130 \mathrm{~W} / \mathrm{m} \cdot \mathrm{K})$ is conducted to the ceramic substrate to which it is attached. The chip is $6 \mathrm{~mm} \times 6 \mathrm{~mm}\( in size and \)0.5 \mathrm{~mm}\( thick and dissipates \)3 \mathrm{~W}\( of power. Disregarding any heat transfer through the \)0.5$-mm- high side surfaces, determine the temperature difference between the front and back surfaces of the chip in steady operation.

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