A 0.3-cm-thick, 12-cm-high, and 18-cm-long circuit board houses 80 closely
spaced logic chips on one side, each dissipating \(0.04 \mathrm{~W}\). The board
is impregnated with copper fillings and has an effective thermal conductivity
of \(30 \mathrm{~W} / \mathrm{m} \cdot \mathrm{K}\). All the heat generated in
the chips is conducted across the circuit board and is dissipated from the
back side of the board to a medium at \(40^{\circ} \mathrm{C}\), with a heat
transfer coefficient of \(40 \mathrm{~W} / \mathrm{m}^{2} \cdot \mathrm{K}\).
(a) Determine the temperatures on the two sides of the circuit board. (b) Now
a \(0.2\)-cm-thick, 12-cm-high, and 18-cmlong aluminum plate \((k=237 \mathrm{~W}
/ \mathrm{m} \cdot \mathrm{K})\) with 864 2-cm-long aluminum pin fins of
diameter \(0.25 \mathrm{~cm}\) is attached to the back side of the circuit board
with a \(0.02\)-cm-thick epoxy adhesive \((k=1.8 \mathrm{~W} / \mathrm{m} \cdot
\mathrm{K})\). Determine the new temperatures on the two sides of the circuit
board.