Chapter 22: Problem 106
How do the structures and properties of elemental silicon and germanium differ from those of tin and lead?
Short Answer
Expert verified
Silicon and germanium are covalent semiconductors with high melting points, while tin and lead are metallic, more malleable, and conductive.
Step by step solution
01
Introduction to Elements
The elements silicon (Si) and germanium (Ge) belong to group 14 of the periodic table, as do tin (Sn) and lead (Pb). This group is characterized by having four valence electrons, leading to similarities in chemical properties. However, they differ significantly in their physical properties.
02
Structure of Silicon and Germanium
Silicon and germanium have a diamond cubic crystal structure. This structure is characterized by each atom being covalently bonded to four other atoms in a tetrahedral arrangement, which makes them semiconductors. Their rigid structure has high resistance to deformation, conferring a relatively high melting point.
03
Structure of Tin and Lead
Tin and lead have metallic structures. Tin exists in two forms: gray tin with a diamond cubic structure at low temperatures, and white tin with a body-centered tetragonal structure at room temperature. Lead has a face-centered cubic structure. These metallic structures allow for easy deformation and conductivity, with lower melting points compared to silicon and germanium.
04
Properties of Silicon and Germanium
Silicon and germanium, as semiconductors, have electrical conductivity that increases with temperature. These elements are brittle and have poor thermal and electrical conductivity compared to metals. Their semiconducting properties are utilized in electronic materials and devices.
05
Properties of Tin and Lead
Tin and lead are good conductors of electricity and heat, typical characteristics of metals. They are malleable and ductile, making them suitable for various industrial applications. Their metallic nature contributes to their versatility in conducting electricity even at lower temperatures.
06
Comparing Density and Melting Points
Silicon and germanium have higher melting points than tin and lead due to their covalent bonding. Meanwhile, tin and lead have higher densities and are heavier due to their metallic nature, which involves close packing of atoms.
Unlock Step-by-Step Solutions & Ace Your Exams!
-
Full Textbook Solutions
Get detailed explanations and key concepts
-
Unlimited Al creation
Al flashcards, explanations, exams and more...
-
Ads-free access
To over 500 millions flashcards
-
Money-back guarantee
We refund you if you fail your exam.
Over 30 million students worldwide already upgrade their learning with Vaia!
Key Concepts
These are the key concepts you need to understand to accurately answer the question.
Group 14 Elements
The periodic table is divided into groups and periods, and Group 14 is known for its versatile elements: Carbon (C), Silicon (Si), Germanium (Ge), Tin (Sn), and Lead (Pb). Each of these elements has four valence electrons. This is why they share similar chemical properties, like forming tetravalent compounds.
Despite these shared electronic characteristics, their physical properties differ significantly. The differences arise from their atomic structure and bonding. For instance, silicon and germanium are often used in semiconductors due to their rigid atomic lattices, while tin and lead are integral to various alloys because of their malleability and conductivity.
Despite these shared electronic characteristics, their physical properties differ significantly. The differences arise from their atomic structure and bonding. For instance, silicon and germanium are often used in semiconductors due to their rigid atomic lattices, while tin and lead are integral to various alloys because of their malleability and conductivity.
Silicon and Germanium Structure
Both silicon and germanium crystallize in the diamond cubic structure. This structural arrangement means that each atom is covalently bonded to four neighbors in a tetrahedral pattern. It's this formation that gives them their semiconducting properties. Silicon and germanium have high melting points as their rigid structure requires significant energy to break.
In this crystal structure, the atoms are not as closely packed as in metals, which allows them to have controlled electronic properties. This makes them less thermally and electrically conductive compared to metals at room temperature, but their conductivity improves with heat. This unique property is exploited in the electronics industry, particularly in transistors and diodes.
In this crystal structure, the atoms are not as closely packed as in metals, which allows them to have controlled electronic properties. This makes them less thermally and electrically conductive compared to metals at room temperature, but their conductivity improves with heat. This unique property is exploited in the electronics industry, particularly in transistors and diodes.
Tin and Lead Properties
Tin and lead, distinctly metallic, exhibit quite different structures compared to silicon and germanium. Tin uniquely has two forms: **gray tin**, which is less stable and shares a diamond cubic structure with silicon and germanium, and **white tin**, with a more common body-centered tetragonal structure at normal conditions. Lead, meanwhile, exists in a face-centered cubic form.
This metallic arrangement gives tin and lead their characteristic properties such as malleability and ductility. Both metals are excellent conductors of heat and electricity, vital for various industrial uses like making solder and using lead in batteries and radiation shields. These properties also result in lower melting points compared to silicon and germanium.
This metallic arrangement gives tin and lead their characteristic properties such as malleability and ductility. Both metals are excellent conductors of heat and electricity, vital for various industrial uses like making solder and using lead in batteries and radiation shields. These properties also result in lower melting points compared to silicon and germanium.
Semiconductors vs Metals
The key difference between semiconductors and metals lies in their conductivity and lattice structure. Semiconductors like silicon and germanium have **variable conductivity**, which increases with temperature. This property is due to the presence of a band gap - an energy gap between the valence band and the conduction band. Electrons need sufficient energy to jump this gap.
Metals, such as tin and lead, display constant conductivity regardless of temperature changes. They have an abundance of free electrons that move easily through the lattice, explaining their excellent conductivity. Their atoms are closely packed, offering malleability and ductility. This makes metals suitable for electrical wiring and component manufacturing, while semiconductors are key in circuits that require precise control of electron flow.
Metals, such as tin and lead, display constant conductivity regardless of temperature changes. They have an abundance of free electrons that move easily through the lattice, explaining their excellent conductivity. Their atoms are closely packed, offering malleability and ductility. This makes metals suitable for electrical wiring and component manufacturing, while semiconductors are key in circuits that require precise control of electron flow.